Title:
レーザ加工装置、及び、レーザ加工装置の集光角設定方法
Document Type and Number:
Japanese Patent JP6633297
Kind Code:
B2
Abstract:
A laser processing machine includes: a laser oscillator which emits laser light; a scanning unit which scans a processing target surface of a work by deflecting the laser light emitted from the laser oscillator; and a focusing unit which is disposed between the laser oscillator and the scanning unit and which focuses the laser light emitted from the laser oscillator. The focusing unit is set so as to focus the laser light at a second position that is more distant from a first position where the laser light is incident vertically than a third position that is farthest from the first position in the processing target surface of the work.
Inventors:
Miya Saki Takayoshi
Yuki Komiya
Takuya Yoshimi
Yuki Komiya
Takuya Yoshimi
Application Number:
JP2015110822A
Publication Date:
January 22, 2020
Filing Date:
May 29, 2015
Export Citation:
Assignee:
Panasonic Device sunx Co., Ltd.
International Classes:
B23K26/064; B23K26/00; B23K26/082
Domestic Patent References:
| JP2001221968A | ||||
| JP2001108930A | ||||
| JP4155304A | ||||
| JP2014188518A | ||||
| JP2008229724A |
Attorney, Agent or Firm:
Akatsuki Joint Patent Office