Title:
圧電振動片及び圧電振動子
Document Type and Number:
Japanese Patent JP6636683
Kind Code:
B2
Abstract:
To increase the strength of mounting at the time of mounting a piezoelectric vibrating piece on a package. In a piezoelectric vibrating piece having a pair of support arm portions which are provided with mount electrodes outside a pair of vibrating arm portions, concave portions to which a conductive adhesive used for mounting to the package can penetrate are formed in side end surfaces on the inner sides in a width direction of the respective support arm portions near the mount electrodes.
Inventors:
Takashi Kobayashi
Application Number:
JP2014045508A
Publication Date:
January 29, 2020
Filing Date:
March 07, 2014
Export Citation:
Assignee:
SII Crystal Technology Co., Ltd.
International Classes:
H03H9/19; H03H9/10; H03H9/215
Domestic Patent References:
| JP2013207527A | ||||
| JP2013219542A | ||||
| JP2011211672A |
Foreign References:
| WO2006114936A1 |
Attorney, Agent or Firm:
Noriaki Uchino
Toru Tanikawa
Takuya Shinoda
Toru Tanikawa
Takuya Shinoda