Title:
樹脂多層基板と回路基板の接合構造
Document Type and Number:
Japanese Patent JP6638769
Kind Code:
B2
Abstract:
A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.
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Inventors:
Xu
Takahiro Baba
Takahiro Baba
Application Number:
JP2018122660A
Publication Date:
January 29, 2020
Filing Date:
June 28, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/14; H05K1/02
Domestic Patent References:
| JP2014127674A | ||||
| JP2012060041A | ||||
| JP8162776A | ||||
| JP2092967U |
Foreign References:
| WO2015033736A1 |
Attorney, Agent or Firm:
Kaede International Patent Office