Title:
ダイヤモンドの加工方法
Document Type and Number:
Japanese Patent JP6644313
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a diamond processing method by etching at high speed and low cost with less damage to the diamond surface.SOLUTION: The diamond processing method includes steps of: forming a film of a metal or a semimetal and an alloy or an inorganic compound on a processing portion of diamond; and etching the portion where the film is formed by using HO under a mixed gas of an inert gas and HO or under vacuum.SELECTED DRAWING: Figure 1
Inventors:
Norio Tokuda
Takao Inokuma
Kazuhiro Nakanishi
Masatsugu Nagai
Takao Inokuma
Kazuhiro Nakanishi
Masatsugu Nagai
Application Number:
JP2015223559A
Publication Date:
February 12, 2020
Filing Date:
November 16, 2015
Export Citation:
Assignee:
Kanazawa University
International Classes:
H01L21/302
Domestic Patent References:
| JP5013382A | ||||
| JP2006335591A | ||||
| JP6049669A | ||||
| JP1039966B2 |
Foreign References:
| US4756794 |
Attorney, Agent or Firm:
Kaichi Otani