Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
舗装構造
Document Type and Number:
Japanese Patent JP6645794
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pavement structure in which a road bed is stacked on a subgrade and further a pavement body is formed on the road bed, the pavement structure preventing a step or a sharp slope from being generated on a road surface at a position at which a structure of the subgrade or a road body under the subgrade changes.SOLUTION: Between a lower layer road bed 5 and an upper layer road bed 7 is provided a settlement suppression layer 6 continuing over both sides of a position at which a structure of a subgrade 4 or a road body under the subgrade changes. The settlement suppression layer 6 includes: granular material including at least any of crushed stone, ballast, and sand; and material having asphalt as its main component. Particles of the granular material are bound by using the material having asphalt as its main component. A net-like body 10 made from steel is embedded in the settlement suppression layer in a direction along a road surface of a pavement body 8, the net-like body dispersing a tensile force and compressive force generated in the settlement suppression layer to gradually cause deformation.SELECTED DRAWING: Figure 2

More Like This:
WO/2006/066516HANDLING FLOOR
Inventors:
Masanari Inaba
Application Number:
JP2015201901A
Publication Date:
February 14, 2020
Filing Date:
October 13, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Japan Constec Co., Ltd.
International Classes:
E01C9/10; E01C7/10
Domestic Patent References:
JP2006028796A
JP8151602A
JP2013015017A
JP2009250006A
JP2010163769A
JP2132707U
JP2000027106A
JP59173706U
JP63219705A
JP3083203U
JP11247114A
Foreign References:
US5106227
Attorney, Agent or Firm:
Kiyoshi Miyakawa



 
Previous Patent: 半導体装置

Next Patent: 網状体の接続構造