Title:
給電導体の埋設構造及び非接触型給電走行路
Document Type and Number:
Japanese Patent JP6647625
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a buried structure for a feeding conductor capable of suppress deterioration of feeding efficiency.SOLUTION: A buried structure comprises: a base side member 13 made of an isolation material; a first conductor 14 and a second conductor 15 laterally arranged with a prescribed pitch; and a front surface member made of a material with a less dielectric loss. The base side member is made of an asphalt material or a cement material mixed with a material with lower dielectric constant, dielectric tangent or both of them, such as ceramic and the like. The first conductor 14 and the second conductor 15 are buried by one of the base side member 13 or the front face member 16, or both of them, and surrounded by the base side member 13 or the front face member 16. Therefore, efficiency degradation due to current leakage is suppressed, at the same time, a propagation loss is reduced, so that wireless feeding can be performed with high power-feeding efficiency.SELECTED DRAWING: Figure 1
Inventors:
Tetsuo Endo
Hiroshi Jinnai
Takashi Ohira
Naoki Sakai
Suzuki Yoshiteru
Sakihara Son Zhou
Hiroshi Jinnai
Takashi Ohira
Naoki Sakai
Suzuki Yoshiteru
Sakihara Son Zhou
Application Number:
JP2016048688A
Publication Date:
February 14, 2020
Filing Date:
March 11, 2016
Export Citation:
Assignee:
Taisei Corporation
Toyohashi University of Technology
Toyohashi University of Technology
International Classes:
H02J50/05; E01C3/02; E01C7/10; E01C7/18; E01C7/26; E01C7/32; E01C7/35; E01C9/00; H01F38/14
Domestic Patent References:
| JP2016063684A | ||||
| JP2012175869A | ||||
| JP2014181546A | ||||
| JP2016010168A |
Attorney, Agent or Firm:
Tetsuya Mori
Hide Tanaka Tetsu
Toru Miyasaka
Hide Tanaka Tetsu
Toru Miyasaka