レーザー加工方法 - Disco Co., Ltd.

Title:

レーザー加工方法

Document Type and Number:

Japanese Patent JP6649705

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a laser processing method capable of removing a crack that occurs along a laser processed groove formed by ablation processing.SOLUTION: A laser processing method includes: a first processing step to form a first laser processed groove 110 along a processing line on a workpiece 10 by irradiating the workpiece with a laser beam of a wavelength having absorptivity with respect to the workpiece along the processing line held by workpiece holding means to perform ablation processing; and a second processing step to position a condensing spot of the laser beam to be condensed by a condenser adjacent to the first laser processed 110, and form a second laser processed groove 140 along the first laser processed groove 110 by irradiating the condensing spot with the laser beam along the first laser processed groove to perform ablation processing. In the second processing step, the condensing spot is superposed with the first laser processed groove to be irradiated with the laser beam.SELECTED DRAWING: Figure 8

Inventors:

Tomoki Yoshino

Application Number:

JP2015125033A

Publication Date:

February 19, 2020

Filing Date:

June 22, 2015

Export Citation:

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