Title:
フェノール樹脂組成物及びフェノール樹脂硬化物
Document Type and Number:
Japanese Patent JP6652050
Kind Code:
B2
Abstract:
The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.
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| JPH01213336 | RESIN COMPOSITION FOR SEALING SEMICONDUCTOR |
| JP3853008 | BINDER COMPOSITION FOR REFRACTORY |
Inventors:
Naoyuki Harada
Takao Kunimi
Takao Kunimi
Application Number:
JP2016523525A
Publication Date:
February 19, 2020
Filing Date:
May 27, 2015
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L61/10; C08G8/10; C08G8/22; C08K5/3477; C08L61/12
Domestic Patent References:
| JP4185624A | ||||
| JP2010235671A | ||||
| JP2012246415A |
Foreign References:
| WO2015118996A1 |
Attorney, Agent or Firm:
Shinji Hayami