Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6655206
Kind Code:
B2
Abstract:
To provide a substrate processing apparatus capable of improving respective processing qualities in a plurality of processing units.SOLUTION: A substrate processing apparatus 1 comprises: a plurality of liquid treatment units SU for performing a liquid treatment on a substrate W; and a plurality of individual air supply parts 51 which are separately provided corresponding to respective liquid treatment units SU and each of which supplies a gas to only one liquid treatment unit SU in a variable manner in supply quantity. The liquid treatment units SU perform the liquid treatment of supplying treatment liquids to the substrate W. The individual air supply parts 51 supply a gas to the corresponding liquid treatment units SU, respectively. In addition, supply quantity of the gas to the liquid treatment unit is controllable in each individual air supply part 51. Accordingly, supply quantity of the gas to the liquid treatment unit SU can be changed with respect to each liquid treatment unit SU. As a result, respective processing qualities in the liquid treatment units SU can be improved favorably.SELECTED DRAWING: Figure 1
Inventors:
Masashi Maeda
Application Number:
JP2019056325A
Publication Date:
February 26, 2020
Filing Date:
March 25, 2019
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; G03F7/30; H01L21/677
Domestic Patent References:
| JP2010087116A | ||||
| JP2003347186A | ||||
| JP2012156488A | ||||
| JP2009010291A | ||||
| JP2013089689A |
Attorney, Agent or Firm:
Tsutomu Sugiya
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname