極低温流体混合物で基板を処理するシステムおよび方法

Title:

極低温流体混合物で基板を処理するシステムおよび方法

Document Type and Number:

Japanese Patent JP6655934

Kind Code:

B2

Abstract:

Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray and may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, a two-stage gas nozzle may be used to expand a fluid mixture with a liquid phase concentration of greater than 10% by weight.

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Inventors:

Jeffrey W butter
Chimaobi Double Bananaso
David Scott Becker

Application Number:

JP2015198665A

Publication Date:

March 04, 2020

Filing Date:

October 06, 2015

Export Citation:

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