Title:
基板及びケーブル接続基板
Document Type and Number:
Japanese Patent JP6658263
Kind Code:
B2
Abstract:
A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.
Inventors:
Taku Osawa
Yoshihiro Morita
Yoshihiro Morita
Application Number:
JP2016087351A
Publication Date:
March 04, 2020
Filing Date:
April 25, 2016
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/46; H01R12/51; H05K1/18
Domestic Patent References:
| JP3140532U |
Foreign References:
| US6541711 | ||||
| US6196876 |
Attorney, Agent or Firm:
Shuhei Katayama