Title:
鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト
Document Type and Number:
Japanese Patent JP6660018
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flux that improves heat slump resistance and wettability of a lead-free solder paste even when an acid activator is used.SOLUTION: A flux for a lead-free solder paste comprises (A) a base resin, (B) an activator, and (C) an amide based compound represented by general formula (1): R(-NHCO-Cy-R), where Rrepresents a 1,2,3-propanetricarboxylic acid residue, Rrepresents hydrogen or a C1-10 linear or branched alkyl group, and Cy represents a cyclohexyl group.SELECTED DRAWING: None
Inventors:
Kubo Natsuki
Fumio Ishiga
Fumio Ishiga
Application Number:
JP2016148822A
Publication Date:
March 04, 2020
Filing Date:
July 28, 2016
Export Citation:
Assignee:
Arakawa Chemical Industry Co., Ltd.
International Classes:
B23K35/363
Domestic Patent References:
| JP2011136365A | ||||
| JP5169294A | ||||
| JP7144292A | ||||
| JP2014148635A |