Title:
少なくとも２つの部品を接合するための方法
Document Type and Number:
Japanese Patent JP6660965
Kind Code:
B2
Abstract:
The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.
Inventors:
Vent Matias
Application Number:
JP2017564377A
Publication Date:
March 11, 2020
Filing Date:
June 22, 2016
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L21/02; B23K20/00; C04B37/00; H01L33/02
Domestic Patent References:
| JP2013243360A | ||||
| JP2000121824A | ||||
| JP61222964A | ||||
| JP9090600A | ||||
| JP2012256857A | ||||
| JP2013041637A | ||||
| JP2011035158A | ||||
| JP2000314975A | ||||
| JP2001042553A | ||||
| JP2017537044A |
Foreign References:
| US20150137150 | ||||
| WO2013080819A1 |
Attorney, Agent or Firm:
Washeda International Patent Office