Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP6662998
Kind Code:
B2
Abstract:
The present invention improves the in-plane uniformity of film formation via a plasma treatment. It is provided a plasma treatment device constituted so that process gas introduced between an electrode plate and a shower plate is exhausted toward a counter electrode through a plurality of small holes formed in the shower plate, the plasma treatment device comprising a diffuser plate having a plurality of small holes, the diffuser plate being arranged substantially parallel with the shower plate, wherein the process gas is introduced between the electrode plate and the diffuser plate, passes through the plural small holes of the diffuser plate, reaches the shower plate and flows out from the plural small holes of the shower plate toward the electrode plate, and wherein within the small holes formed in the diffuser plate and the small holes formed in the shower plate, the small holes formed in a plate which exists more downstream along a flowing direction of the process gas are made in smaller diameters and an aperture ratio of each plate is made smaller in a plate which exists more upstream along the flowing direction of the process gas.
Inventors:
Toshiaki Yoshimura
Hiroyuki Minowa
Stone ryuki
Hiroyuki Minowa
Stone ryuki
Application Number:
JP2018502465A
Publication Date:
March 11, 2020
Filing Date:
March 03, 2016
Export Citation:
Assignee:
Core Technology Co., Ltd.
Asukagi Co., Ltd.
Asukagi Co., Ltd.
International Classes:
C23C16/455; C23C16/50; H01L21/205; H01L21/31; H05H1/46
Domestic Patent References:
| JP5152218A | ||||
| JP2006121057A | ||||
| JP2013149513A | ||||
| JP2000290777A | ||||
| JP2012518253A | ||||
| JP2006120872A | ||||
| JP2005220368A |
Attorney, Agent or Firm:
Kenichiro Matsuo
Yasuo Ichikawa
Yasuo Ichikawa