Title:
部品供給装置、表面実装機、及び部品の供給方法
Document Type and Number:
Japanese Patent JP6663915
Kind Code:
B2
Abstract:
A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.
Inventors:
Kazuyoshi Oyama
Houka Honkashi
Tsutomu Yanagida
Houka Honkashi
Tsutomu Yanagida
Application Number:
JP2017521395A
Publication Date:
March 13, 2020
Filing Date:
June 02, 2015
Export Citation:
Assignee:
YAMAHA HATSUDOKI KABUSHIKI KAISHA
International Classes:
H05K13/02; H05K13/08
Domestic Patent References:
| JP2014011368A | ||||
| JP2015065381A | ||||
| JP201411291A |
Foreign References:
| WO2014002912A1 |
Attorney, Agent or Firm:
Akatsuki Joint Patent Office