Title:
低圧冷媒に適した熱交換装置
Document Type and Number:
Japanese Patent JP6665312
Kind Code:
B2
Abstract:
Embodiments of the present disclosure are directed to a heat exchange device that includes a condenser configured to receive a refrigerant, an evaporator having an evaporation tube bundle, a throttling device configured to receive a first portion of the refrigerant from the condenser and to expand the first portion of the refrigerant before directing the first portion to the evaporator, and an ejector having a high pressure conduit, a low pressure conduit, and an outlet conduit, the ejector is configured to receive the first portion from the throttling device or a second portion of the refrigerant from the condenser via the high pressure conduit, receive a third portion of the refrigerant from the evaporator via the low pressure conduit, mix the first portion or the second portion with the third portion to form a mixed refrigerant, and direct the mixed refrigerant to the evaporator via the outlet conduit.
Inventors:
Siupean Sue
Lee Warne
Lee Warne
Application Number:
JP2018546425A
Publication Date:
March 13, 2020
Filing Date:
February 28, 2017
Export Citation:
Assignee:
Johnson Controls Technology Company
International Classes:
F25B39/02
Domestic Patent References:
| JP61140750A | ||||
| JP2015515601A | ||||
| JP4116205A | ||||
| JP8145502A |
Attorney, Agent or Firm:
Shinjiro Ono
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Shigeo Takeuchi
Yoshiyuki Tamura
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Shigeo Takeuchi
Yoshiyuki Tamura