Title:
銅三次元ナノ構造体の製造方法
Document Type and Number:
Japanese Patent JP6665364
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a copper three-dimensional nanostructure with a form where thin sheet-shaped precipitates made of copper are intermingled at random on a substrate by an electrolytic copper plating method, in which the structure of the copper three-dimensional nanostructure is retained, and further, the connection strength with the substrate is increased to improve the mechanical strength of the copper three-dimensional nanostructure.SOLUTION: Provided is a method for producing a copper three-dimensional nanostructure comprising: a step where a copper three-dimensional nanostructure is formed on a substrate; and a step where reinforcing plating is applied to the substrate formed with the three-dimensional nanostructure. In the step of applying the reinforcing plating 14, using a plating added with an additive (PEG+SPS) selectively precipitating copper on the base part side than the tip side of the copper three-dimensional structure formed at the substrate, plating is performed.SELECTED DRAWING: Figure 5
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Inventors:
Susumu Arai
Application Number:
JP2016046711A
Publication Date:
March 13, 2020
Filing Date:
March 10, 2016
Export Citation:
Assignee:
Shinshu University
International Classes:
C25D5/16; C25D3/38; C25D5/10
Domestic Patent References:
| JP2015042776A | ||||
| JP2014080674A |