Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
多孔質支持体、多孔質支持体の製造方法、分離膜構造体及び分離膜構造体の製造方法
Document Type and Number:
Japanese Patent JP6667614
Kind Code:
B2
Abstract:
A porous support includes a base body, a supporting layer, and a topmost layer. The supporting layer is disposed between the base body and the topmost layer, and makes contact with the topmost layer. A ratio of a porosity of the topmost layer to a porosity of the supporting layer is greater than or equal to 1.08. A ratio of a thickness of the topmost layer to a thickness of the supporting layer is less than or equal to 0.9.

Inventors:
Miyahara Makoto
Kenji Tanijima
Application Number:
JP2018508894A
Publication Date:
March 18, 2020
Filing Date:
March 08, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01D69/10; B01D69/12; C04B41/85; C04B41/89
Domestic Patent References:
JP2005081246A
JP2010188262A
JP2009220039A
Foreign References:
WO2015146354A1
WO2013042262A1
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation