Title:
多孔質支持体、多孔質支持体の製造方法、分離膜構造体及び分離膜構造体の製造方法
Document Type and Number:
Japanese Patent JP6667614
Kind Code:
B2
Abstract:
A porous support includes a base body, a supporting layer, and a topmost layer. The supporting layer is disposed between the base body and the topmost layer, and makes contact with the topmost layer. A ratio of a porosity of the topmost layer to a porosity of the supporting layer is greater than or equal to 1.08. A ratio of a thickness of the topmost layer to a thickness of the supporting layer is less than or equal to 0.9.
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Inventors:
Makoto Miyahara
Kenji Tanijima
Kenji Tanijima
Application Number:
JP2018508894A
Publication Date:
March 18, 2020
Filing Date:
March 08, 2017
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01D69/10; B01D69/12; C04B41/85; C04B41/89
Domestic Patent References:
| JP2005081246A | ||||
| JP2010188262A | ||||
| JP2009220039A |
Foreign References:
| WO2015146354A1 | ||||
| WO2013042262A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation