Title:
撮像装置
Document Type and Number:
Japanese Patent JP6671060
Kind Code:
B2
Abstract:
To obtain an operation environment having high reliability even in a high-temperature state by efficiently radiating heat generated from a substrate due to a light-emitting element, in an imaging apparatus.SOLUTION: In an imaging apparatus 1, LED elements 40, 40, ... for emitting illumination light in the imaging direction of a camera part 20 are mounted on the first surface 30a of a substrate 30 in the state of being electrically connected to first and second wiring patterns 31 and 32. A first heat radiation member 50 and second heat radiation members 60 and 60 are attached to the substrate 30 in such a state that the substrate 30 is held between the first heat radiation member 50 and the heat radiation members 60 and 60. The first heat radiation member 50 is arranged in a position facing the first surface 30a. Each of the second heat radiation members 60 and 60 is arranged in the position facing a second surface 30b and arranged so as to include the position facing the LED elements 40 and 40 through the substrate 30.SELECTED DRAWING: Figure 4
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Inventors:
Shinichi Wada
Application Number:
JP2018229112A
Publication Date:
March 25, 2020
Filing Date:
December 06, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
G03B15/05; B60R11/04; G03B15/00; G03B15/03; G03B17/02; G03B17/55; H04N5/225
Domestic Patent References:
JP2007121593A | ||||
JP2006074853A | ||||
JP4137597A | ||||
JP2005150132A | ||||
JP2017520443A | ||||
JP2006033296A | ||||
JP2008211378A | ||||
JP63292119A |
Foreign References:
WO2011142111A1 |
Attorney, Agent or Firm:
Hiromori Arai
Eisaku Teratani
Shinichi Michisaka
Eisaku Teratani
Shinichi Michisaka