Title:
半導体加工用両面粘着テープ
Document Type and Number:
Japanese Patent JP6673677
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a double-sided adhesive tape for semiconductor processing, which is used when manufacturing IC chips for reinforcing a semiconductor wafer by bonding the semiconductor wafer and a support plate and enables the double-sided adhesive tape for semiconductor processing to be securely peeled off from the support plate by stimulation.SOLUTION: Provided is a double-sided adhesive tape for semiconductor processing, which is used when manufacturing IC chips for reinforcing a semiconductor wafer by bonding the semiconductor wafer and a support plate, comprising a substrate and adhesive layers formed on both surfaces of the substrate. The adhesive layer on the side bonding to the support plate is one containing a gas generating agent which generates gas by stimulation. Also, the substrate has dot-like release treatment part on the side adjoining the adhesive layer which adjoins the support plate. When peeling force between the substrate and the adhesive layer on the side bonding to the support plate in the dot-like release treatment part is denoted by x (N/mm), peeling force between the substrate and the adhesive layer on the side bonding to the support plate in the part other than the dot-like release treatment part is denoted by y (N/mm), and a diameter of the dot-like release treatment portion is denoted by z (mm), the following formulas are satisfied.SELECTED DRAWING: None
Inventors:
Okuyama Kosho
Munehiro Hatai
Takahiro Aso
Ueda Kozo
Keita Fujiwara
Munehiro Hatai
Takahiro Aso
Ueda Kozo
Keita Fujiwara
Application Number:
JP2015234857A
Publication Date:
March 25, 2020
Filing Date:
December 01, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J7/00; C09J201/00; H01L21/304; H01L21/683
Domestic Patent References:
| JP7061458A | ||||
| JP2017082094A | ||||
| JP2017036401A | ||||
| JP2014070221A |
Foreign References:
| WO2009075196A1 |
Attorney, Agent or Firm:
Atomi International Patent Office