Title:
冷却システム
Document Type and Number:
Japanese Patent JP6674538
Kind Code:
B2
Abstract:
A cooling system includes: a placement plate on which a plurality of components are disposed; and a liquid refrigerant flow path, which is formed on an opposite side of the placement plate with respect to the plurality of components, and is configured to allow a liquid refrigerant for cooling the plurality of components to flow therethrough. The path includes: a first heat-radiating portion disposed at a liquid refrigerant inlet portion around which fins are disposed such that distances from a flow-path inlet portion to the fins are gradually farther away from a flow-path side wall toward a center of the path; a second heat-radiating portion which includes fins having a curved shape; a third heat-radiating portion having no fins; a fourth heat-radiating portion having higher fin-mounting density than the first and the second heat-radiating portions, an inlet and an outlet through which the liquid refrigerant flows in and out.
Inventors:
Yugo Asai
Shinozaki, Ken
Hiroyuki Ushifusa
Shinozaki, Ken
Hiroyuki Ushifusa
Application Number:
JP2018516597A
Publication Date:
April 01, 2020
Filing Date:
November 22, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/473; H05K7/06; H05K7/20
Domestic Patent References:
| JP2015226039A | ||||
| JP2010153785A | ||||
| JP2013165097A |
Foreign References:
| WO2016194158A1 |
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda
Junichiro Yoshida
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda
Junichiro Yoshida