Title:
樹脂組成物、接着剤、および封止剤
Document Type and Number:
Japanese Patent JP6675380
Kind Code:
B2
Abstract:
There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.
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Inventors:
Kazuki Iwatani
Arai Fumi
Arai Fumi
Application Number:
JP2017505348A
Publication Date:
April 01, 2020
Filing Date:
March 08, 2016
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08G75/045; C08F299/04; C08K5/37; C08L63/08; C09J11/06; C09J181/00
Domestic Patent References:
| JP60108430A | ||||
| JP2014077024A |
Foreign References:
| WO2013137087A1 | ||||
| WO2005052051A1 | ||||
| WO2013005471A1 |
Attorney, Agent or Firm:
Yusuke Watanabe