Title:
接合構造および電子部材接合構造体
Document Type and Number:
Japanese Patent JP6678374
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a junction structure preventing the occurrence of transversal cracks at a junction between a metal substrate and a metal porous body after the occurrence of longitudinal cracks in the metal porous body, and thereby capable of achieving highly reliable junction.SOLUTION: A junction structure of the present invention includes a metal substrate 1 and a metal porous body 2 formed on the metal substrate 1. The metal porous body 2 has: an external layer 2b including one main surface 2a and formed on a side of the metal substrate 1; and an inner layer 2c formed at a position further apart from the metal substrate 1 in a thickness direction than the external layer 2b. The average crystal grain size ds in the external layer 2b is greater than the average crystal grain size di in the inner layer 2c.
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Inventors:
Naoyuki Kojima
Kazuto Hikasa
Shunichiro Sato
Hidemichi Fujiwara
Masato Watanabe
Kunio Shiokawa
Tatsuhiko Asai
Hiroaki Sozono
Kazuto Hikasa
Shunichiro Sato
Hidemichi Fujiwara
Masato Watanabe
Kunio Shiokawa
Tatsuhiko Asai
Hiroaki Sozono
Application Number:
JP2013211575A
Publication Date:
April 08, 2020
Filing Date:
October 09, 2013
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
Fuji Electric Co., Ltd.
Fuji Electric Co., Ltd.
International Classes:
H01L21/52; B22F7/04
Domestic Patent References:
| JP2011249361A | ||||
| JP10280072A | ||||
| JP200962610A |
Foreign References:
| WO2011149065A1 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi