Title:
電子デバイス、電子デバイスの製造方法、物理量センサー、電子機器および移動体
Document Type and Number:
Japanese Patent JP6680079
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device, an electronic apparatus, and a mobile body which shorten a wire as much as possible, which maintain sufficient mounting strength, and which can reduce deterioration in vibration characteristics.SOLUTION: An electronic device includes: a functional element; a support substrate which includes an opening, and which is arranged in a manner to overlap with the functional element in planer view of the functional element; and a wire which connects the functional element and the support substrate while passing through the opening, and which supports the functional element in a state to suspend it from the support substrate.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Takayuki Kikuchi
Application Number:
JP2016103979A
Publication Date:
April 15, 2020
Filing Date:
May 25, 2016
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G01C19/5628; H01L41/053; H01L41/09; H01L41/113; H01L41/25; H03H3/02; H03H9/09
Domestic Patent References:
| JP2009150677A | ||||
| JP2009128272A | ||||
| JP2007278920A | ||||
| JP2005010034A | ||||
| JP2009130236A |
Attorney, Agent or Firm:
Kazuaki Watanabe
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka