Title:
研磨装置
Document Type and Number:
Japanese Patent JP6685707
Kind Code:
B2
Abstract:
The invention discloses a grinding device. The grinding device comprises a chuck work bench, which is used to maintain a wafer; a grinding unit, which is provided with a grinding pad disposed opposite to the wafer and used to grind the wafer disposed on the chuck work bench; a grinding pad feeding unit, which is used to drive the grinding pad of the grinding unit to move close to or away from the wafer disposed on the chuck workbench; and a slurry supply mechanism, which is used to supply the wafer on the chuck workbench and the grinding pad with slurry. The slurry supply mechanism comprises a container, which is provided with space having an opened upper part disposed around the chuck workbench, and is used to store the slurry; a slurry splashing unit, which is disposed on the bottom part of the container, and is used to enable the splashing of the slurry stored in the container, and then is used to provide the slurry to the grinding pad protruded from the chuck work bench in a suspended manner.
Inventors:
Satoshi Yamanaka
Takuya Mihara
Takuya Mihara
Application Number:
JP2015234563A
Publication Date:
April 22, 2020
Filing Date:
December 01, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B57/02; B24B37/00; B24B37/04; B24B55/06; H01L21/304
Domestic Patent References:
| JP2000158331A | ||||
| JP6302567A | ||||
| JP2005153090A | ||||
| JP2005103696A |
Foreign References:
| US20100285723 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Sachiko Okunuki
Kojino Koji