Title:
成膜装置、成膜方法、及び電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6686100
Kind Code:
B2
Abstract:
To provide: an electrostatic chuck device having a structure where power can be supplied to an electrostatic chuck while an effect on uniformity of magnetic force applied by magnetic force applying means is reduced, in a film-forming device having a structure where a substrate is held using the electrostatic chuck and the substrate is brought into close contact with a mask using the magnetic force applying means; a mask attaching device; a film-forming device including them; a film-forming method using them; and a method for manufacturing an electronic device.SOLUTION: An electrostatic chuck device includes: an electrostatic chuck plate part including a first surface facing magnetic force applying means for attaching a mask onto a film forming surface of a substrate by a magnetic force from a magnetic force generating part, and a second surface opposite to the first surface and holding a surface opposite to the film forming surface of the substrate; and a power supply terminal part for supplying power to the electrostatic chuck plate part. The power supply terminal part is installed outside a region where the magnetic force generating part of the magnetic force applying means is disposed.SELECTED DRAWING: Figure 3
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Inventors:
Hiroshi Ishii
Kashiwakura Kazushi
Kashiwakura Kazushi
Application Number:
JP2018200353A
Publication Date:
April 22, 2020
Filing Date:
October 24, 2018
Export Citation:
Assignee:
Canon Tokki Co., Ltd.
International Classes:
H01L21/683; C23C14/04; C23C14/24; C23C14/50; H01L51/50; H02N13/00; H05B33/10
Domestic Patent References:
| JP2017076674A | ||||
| JP2011071445A | ||||
| JP2012235095A | ||||
| JP6204325A | ||||
| JP2014065959A |
Foreign References:
| WO2009069743A1 |
Attorney, Agent or Firm:
Hidewa Patent Office