Title:
絶縁樹脂フィルム、支持体付き絶縁樹脂フィルム及び多層プリント配線板
Document Type and Number:
Japanese Patent JP6686418
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an insulative resin film which enables the increase in via post removability; and a multilayer printed wiring board formed by the insulative resin film.SOLUTION: An insulative resin film for a multilayer printed wiring board is formed by a thermosetting resin composition including (a) an epoxy resin, (b) a phenol resin, (c) an inorganic filler, and (d) a phosphorus-based hardening accelerator. The insulative resin film is obtained through the step of forming a via-hole by removing a photosensitive resin layer.SELECTED DRAWING: None
Inventors:
Yuta Ozeki
Kaoru Yamada
Daisuke Fujimoto
Kaoru Yamada
Daisuke Fujimoto
Application Number:
JP2015246752A
Publication Date:
April 22, 2020
Filing Date:
December 17, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/46; C08J5/18; H05K1/03
Domestic Patent References:
| JP2015036392A | ||||
| JP2011179008A | ||||
| JP2015162635A |
Foreign References:
| WO2013054790A1 | ||||
| WO2008099732A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama