Title:
ポリアミド酸、ポリイミド、ポリアミド酸溶液、およびポリイミドの利用
Document Type and Number:
Japanese Patent JP6687442
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide polyimide that is excellent in heat resistance and low thermal expansion property as well as transparency and further exhibits adhesiveness to an inorganic substrate, polyamide acid as a precursor thereof and a product or a member having high requirements for heat resistance and transparency by using the polyimide and the polyamide acid, especially a product and a member suitable for the applications of forming the polyimide and the polyamide acid on an inorganic article surface such as glass, metal, metal oxide and single crystal silicon.SOLUTION: There is provided polyamide acid represented by a specific repeating unit, where an acid anhydride residue contains diphenyl or di(3,4-amide acid benzoic acid)-paradioxybenzene ester and at least 50 mol% or more of a diamine residue contains a cyclohexane ring in the constitutional units.SELECTED DRAWING: None
Inventors:
Hirofumi Nakayama
Uno Mari
Uno Mari
Application Number:
JP2016064189A
Publication Date:
April 22, 2020
Filing Date:
March 28, 2016
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G73/10
Domestic Patent References:
| JP2002161136A |
Foreign References:
| WO2005113647A1 |
Attorney, Agent or Firm:
Nao Murakami