Title:
ワイドギャップ半導体基板の欠陥検査装置
Document Type and Number:
Japanese Patent JP6688184
Kind Code:
B2
Abstract:
Provided is a defect inspection device in which an imaging range of an object to be examined is variable, and which, despite having a simple device configuration, is capable of performing faster and more reliable defect inspection than is conventionally possible, and is also capable of preventing an extension of a defect. Specifically, a defect inspection device for inspecting a defect caused in a wide-gap semiconductor substrate is provided with an excitation light irradiation unit, a fluorescence imaging unit, and a control unit. The fluorescence imaging unit is provided with a plurality of objective lenses having different observation magnification ratios, and with an imaging magnification ratio switching unit which selects one of the plurality of objective lenses to be switched for use as the objective lens. The excitation light irradiation unit is provided with an irradiation magnification ratio modification unit which modifies the irradiation range and energy density of excitation light. In accordance with the observation magnification ratio of the objective lens selected by the imaging magnification ratio switching unit, the control unit modifies the irradiation range and energy density of the excitation light in an illumination magnification ratio modification unit.
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Inventors:
Hiroyuki Murata
Application Number:
JP2016141943A
Publication Date:
April 28, 2020
Filing Date:
July 20, 2016
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/66; G01N21/64; G01N21/88
Domestic Patent References:
| JP2008249506A | ||||
| JP5633099B2 |