Title:
カメラモジュール、およびカメラモジュールの製造方法、撮像装置、並びに電子機器
Document Type and Number:
Japanese Patent JP6690157
Kind Code:
B2
Abstract:
The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole. Subsequently, after adhesion is performed with thermosetting resin, reinforcement resin that reinforces the bonding section between the rigid flexible substrate and the FPC drawer unit or that reinforces the bonding section between the rigid flexible substrate and the frame is applied so as to close a portion of the range on which the adhesive has not been applied. This enables omitting the process of closing the vent hole. The present technology can be applied to a camera module.
Inventors:
Eiichiro Dobashi
Takahiro Wakabayashi
Takahiro Wakabayashi
Application Number:
JP2015177857A
Publication Date:
April 28, 2020
Filing Date:
September 09, 2015
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H04N5/225; G03B17/02
Domestic Patent References:
| JP200572978A | ||||
| JP2008312104A | ||||
| JP799214A |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto