Title:
超音波トランスデューサー、超音波プローブ、超音波装置、超音波トランスデューサーの製造方法、及び振動装置
Document Type and Number:
Japanese Patent JP6693154
Kind Code:
B2
Abstract:
An ultrasonic sensor includes: a substrate in which an opening is formed; a vibration film that is provided on the substrate so as to close the opening; a plurality of vibration elements that are disposed at positions where the vibration film and the opening overlap each other in a plan view along a thickness direction of the vibration film; a sealing plate that is disposed so as to face the vibration film, supports the vibration film, and has a surface facing the vibration film as a flat surface; and a suppressing portion that is provided between the adjacent vibration elements in the plan view, is bonded to both the vibration film and the sealing plate, and is formed of a resin material for suppressing transmission of vibration of the vibration film.
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Inventors:
Kojima Riki
Koji Ohashi
Koji Ohashi
Application Number:
JP2016020036A
Publication Date:
May 13, 2020
Filing Date:
February 04, 2016
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H04R17/00; A61B8/14; H04R31/00
Domestic Patent References:
| JP2015188208A | ||||
| JP2011099675A | ||||
| JP2015097733A |
Attorney, Agent or Firm:
Intellectual Property Office