硬化性樹脂組成物、硬化膜及び表示装置

Title:

硬化性樹脂組成物、硬化膜及び表示装置

Document Type and Number:

Japanese Patent JP6695369

Kind Code:

B2

Abstract:

To provide a curable resin composition that contains a semiconductor particle and has excellent patterning properties, and a cured film formed therefrom, and a display device containing the cured film.SOLUTION: A curable resin composition contains a semiconductor particle (A), a compound containing a polyalkylene glycol structure and having a polar group at its molecular terminal (B), a resin (C) and a polymerizable compound (D). There are also provided a cured film formed therefrom, and a display device containing the cured film.SELECTED DRAWING: None

More Like This:

JP4824971	Nano substance-containing composition, its production method and composite using it
JP5544136	The photopolymer combination thing which has low bridge construction density
WO/2022/181563	PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT

Inventors:

Megumi Hayasaka
Yoshihiro Harada

Application Number:

JP2018021624A

Publication Date:

May 20, 2020

Filing Date:

February 09, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Sumitomo Chemical Co., Ltd.

International Classes:

C08F2/44; C08F265/02; G02B5/20; G03F7/004

Domestic Patent References:

JP2002241509A
JP2017032918A
JP2016053716A

Foreign References:

WO2016035602A1

Attorney, Agent or Firm:

Fukami patent office

Previous Patent: 鞍乗り型車両の車体フレーム補強構造

Next Patent: 適応発電管理