Title:
印刷用レジスト組成物及びレジスト膜形成方法
Document Type and Number:
Japanese Patent JP6696708
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition for printing capable of forming a coated film which satisfies flame retardancy needed for a solder resist film, is especially good in screen printability and excellent in resolution and excellent in low warpage property and flexibility.SOLUTION: There is provided a resist composition for printing containing a biphenylaralkyl type epoxy resin (A), at least one kind of amine curing agent having amine value in a range of 100 to 500 mgKOH/g, fine particle silica (C) having average primary particle diameter in a range of 1 to 100 nm, a flaky loading pigment (D) and an organic solvent (E) with content of the component (D) of 0.1 to 100 pts.mass based on 100 pts.mass of a resin solid component of the epoxy resin (A).SELECTED DRAWING: None
Inventors:
Ryo Totsuka
Onishi Kenyo
Onishi Kenyo
Application Number:
JP2015211842A
Publication Date:
May 20, 2020
Filing Date:
October 28, 2015
Export Citation:
Assignee:
KANSAI PAINT CO.,LTD.
International Classes:
H05K3/28; C08G59/50; C08K3/30; C08K3/36; C08K7/00; C08L63/00
Domestic Patent References:
| JP55027365A | ||||
| JP2011026419A | ||||
| JP2009256626A |
Foreign References:
| WO2006118105A1 | ||||
| WO2013161756A1 | ||||
| WO2013022068A1 | ||||
| WO2009096507A1 |