Title:
金型装置
Document Type and Number:
Japanese Patent JP6702007
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate poor molding caused by a decrease in the temperature of molten resin.SOLUTION: In a mold apparatus, a retention member 80 is fixed on second molds 42, 70 so as to partly protrude to a cavity 12 having an annular shape, a metal component 93 having an annular shape is positioned and retained at the retention member 80 and the second molds 42, 70, a first mold 22 and the second molds 42, 70 are brought in contact with each other, and molten resin is allowed to flow into the cavity 12 in order of a first supply passage 16B that has an annular shape and extends in an axial direction, a second supply passage 16A that has an annular shape and extends in an axial direction and an outer diameter direction, and a gate 18 that has an annular shape and extends in an axial direction, thereby molding, in the cavity 12, a resin product 93 of which an inner peripheral side is provided with a metal component 93 and an outer peripheral side is provided with a resin component 92. An annular recess 67 is formed in an end face, closer to the retention member 80, of a core cylinder 60, a heat insulating material 68 having an annular shape is arranged on the annular recess 67, and the metal component 93 is brought in contact with the heat insulating material 68 to prevent the heat of the core cylinder 60 from transferring to the metal component 93 when the first mold 22 and the second mold 42 are brought in contact with each other.SELECTED DRAWING: Figure 1
Inventors:
Yu Suematsu
Koji Okumura
Koji Okumura
Application Number:
JP2016119320A
Publication Date:
May 27, 2020
Filing Date:
June 15, 2016
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B29C45/26; B29C45/27
Domestic Patent References:
| JP2015112728A | ||||
| JP4176620A | ||||
| JP11028727A | ||||
| JP2002240103A | ||||
| JP2005053226A |