Title:
パターン形成方法、電子デバイスの製造方法、キット
Document Type and Number:
Japanese Patent JP6703124
Kind Code:
B2
Abstract:
An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance.The pattern forming method of the present invention is a pattern forming method including a resist film forming step of forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film using a developer, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin represented by a specific structure; and as the developer, a chemical liquid containing an organic solvent, alcohol impurities, and metal impurities containing at least metal atoms is used, the total content of the alcohol impurities being 0.01 mass ppb to 1000 mass ppm with respect to the total mass of the chemical liquid.
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Inventors:
Tetsuya Uemura
Application Number:
JP2018542915A
Publication Date:
June 03, 2020
Filing Date:
September 29, 2017
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/32; G03F7/004; G03F7/038; G03F7/039; G03F7/16; G03F7/20
Domestic Patent References:
| JP2012032788A | ||||
| JP2000288458A |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mitsuhashi
Fumio Mitsuhashi