Title:
研削装置
Document Type and Number:
Japanese Patent JP6704256
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a crack of a workpiece even when a grinding stone is chipped.SOLUTION: A grinding device 1 includes: a chuck table 4 for holding a wafer W; grinding means 10 for grinding the wafer W held on the chuck table 4; grinding/feeding means 20 for grinding and feeding the grinding means 10 and the chuck table 4 in directions of relatively approaching and separating; and chip detection means 30 for detecting a chip of a grinding stone 17. The chip detection means 30 includes: a light transmission sensor 31 in which the grinding stone 17 can enter an air gap 312 between a light projection part 310 and a light receiving part 311 in a radial direction of a grinding wheel 16; moving means 32 which moves the light transmission sensor 31 between a detection position and a retreat position; and a determination part 33 which determines the grinding stone 17 is chipped when an amount of received light received by the light receiving part 311 is a predetermined threshold or higher. Therefore, the chip on the grinding wheel 17 can be detected based on the amount of received light of measurement light received by the light receiving part 311, and a crack of the wafer W can be prevented in advance.SELECTED DRAWING: Figure 1
Inventors:
Satoshi Yamanaka
Chishima Kazushi
Chishima Kazushi
Application Number:
JP2016009559A
Publication Date:
June 03, 2020
Filing Date:
January 21, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B49/12; B24D3/18
Domestic Patent References:
| JP2015036170A | ||||
| JP2006287111A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office