Title:
発光モジュール及び発光モジュールの製造方法
Document Type and Number:
Japanese Patent JP6704965
Kind Code:
B2
Abstract:
A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
Inventors:
Volume Keiichi
Application Number:
JP2018166801A
Publication Date:
June 03, 2020
Filing Date:
September 06, 2018
Export Citation:
Assignee:
Toshiba Hokuto Electronics Co., Ltd.
International Classes:
H01L33/62; H01L33/54; H01L33/56
Domestic Patent References:
| JP2011134926A | ||||
| JP2008034473A | ||||
| JP2004335916A | ||||
| JP2004237447A | ||||
| JP2009010942A | ||||
| JP2012241147A | ||||
| JP2004237499A | ||||
| JP2004259984A | ||||
| JP2013151655A | ||||
| JP2012231018A | ||||
| JP2010123802A |
Foreign References:
| WO2011027815A1 | ||||
| WO2013080596A1 | ||||
| WO2013069232A1 | ||||
| US20090093088 | ||||
| CN103183926A |
Attorney, Agent or Firm:
Amagi International Patent Office