Title:
照明装置
Document Type and Number:
Japanese Patent JP6704967
Kind Code:
B2
Abstract:
A lighting apparatus comprising a printed circuit board (110), a plurality of light sources (130) disposed on the PCB (110), a reflecting unit (120) disposed on the PCB (110), a resin layer (140) disposed on the reflecting unit (120) to cover the plurality of light sources (130); and an optical pattern layer (150) comprising a first optical layer (150B) disposed on the resin layer (140), a second optical layer (150A) spaced apart from the first optical layer (150B), a plurality of optical patterns (151) and a bonding pattern layer (153) that are disposed between the first optical layer (150B) and the second optical layer (150A), and a second spaced area (152) disposed around the optical patterns (151) and separating the bonding pattern layer (153) from the optical patterns (151).
Inventors:
Lee, Byung Young
Park, Mouryeong
Park, Gwangho
Kim, Chur Hong
Park, Mouryeong
Park, Gwangho
Kim, Chur Hong
Application Number:
JP2018170670A
Publication Date:
June 03, 2020
Filing Date:
September 12, 2018
Export Citation:
Assignee:
LG Innotek Co., Ltd
International Classes:
F21S2/00; G02F1/13357; F21W107/10
Domestic Patent References:
| JP2009193955A | ||||
| JP2003222714A |
Foreign References:
| US20090180282 | ||||
| KR1020120003272A |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase