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Patent Searching and Data


Title:
カッティング装置
Document Type and Number:
Japanese Patent JP6705713
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device capable of eliminating effect due to foreign material such as residue associated with cutting and smoothly and efficiently performing a cutting work.SOLUTION: A cutting device comprises: a conveyor 5 for transporting a target object to be cut 2; and a cutter 12 which is moved at a same speed as a speed at which the conveyor 5 is moved, and lowered to the cutting object 2 for cutting the target object 2. A removal device 20 for spraying air from obliquely above the cutter 12 for blowing away a foreign material adhered to the cutter 12 is provided at a position on a front side of a position EP where the cutter 12 is furthest lowered in a transport direction of the target object 2 by the conveyor 5. A scraper 22 for discharging a foreign material adhered to the surface of the conveyor 5 to both end sides in a width direction of the conveyor 5 is provided at a position on a front side of the removal device 20 in the transport direction.SELECTED DRAWING: Figure 1

Inventors:
Akira Kawazoe
Soichiro Tanaka
Isao Kimura
Application Number:
JP2016142830A
Publication Date:
June 03, 2020
Filing Date:
July 20, 2016
Export Citation:
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Assignee:
Daiwa Seikan Co., Ltd.
Daiwa Service Co., Ltd.
Kinjo Kiko Co., Ltd.
International Classes:
B26D7/18; B26D1/60
Domestic Patent References:
JP5719472B1
JP10156796A
JP3277497A
JP9224545A
JP7236407A
JP2001322088A
JP200688252A
JP7172080A
Foreign References:
CN102039613A
Attorney, Agent or Firm:
Watanabe strong