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Title:
プローブガイド板及びその製造方法とプローブ装置
Document Type and Number:
Japanese Patent JP6706076
Kind Code:
B2
Abstract:
A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.

Inventors:
Kosuke Fujiwara
Yuichiro Shimizu
Application Number:
JP2016004970A
Publication Date:
June 03, 2020
Filing Date:
January 14, 2016
Export Citation:
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Assignee:
Shinko Electric Industry Co., Ltd.
Nippon Electronic Materials Co., Ltd.
International Classes:
G01R1/06; H01L21/66
Domestic Patent References:
JP2007171139A
JP2000243942A
JP2001118943A
JP11258295A
JP2014232030A
Foreign References:
US7546670
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Keizo Okamoto



 
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