Title:
導電性接着剤、電子部品および電子部品の製造方法
Document Type and Number:
Japanese Patent JP6710120
Kind Code:
B2
Abstract:
To provide a conductive adhesive that can form a conductive connection structure excellent in voltage resistance while maintaining conductivity, to provide an electronic component including members electrically connected by using the conductive adhesive and to provide a method for manufacturing an electronic component by using the conductive adhesive. The conductive adhesive including thermofusible conductive particles forms an anisotropic conductive bond between members by performing thermal compression bonding and the blending amount of the thermofusible conductive particles is 0.01 to 4.0 vol% in terms of solids.
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Inventors:
Kazunobu Fukushima
Masaki Sasaki
Kazuki Nakada
Daisaku Sudo
Kentaro Ohbuchi
Masaki Sasaki
Kazuki Nakada
Daisaku Sudo
Kentaro Ohbuchi
Application Number:
JP2016130791A
Publication Date:
June 17, 2020
Filing Date:
June 30, 2016
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C09J201/00; C09J9/02; C09J11/04; H01B1/22; H01B5/16; H01L21/60; H05K1/14
Domestic Patent References:
| JP2014065766A | ||||
| JP6187834A | ||||
| JP2000340036A | ||||
| JP2014078480A | ||||
| JP2010226140A |
Foreign References:
| WO2015029696A1 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro