Title:
半導体デバイス
Document Type and Number:
Japanese Patent JP6712620
Kind Code:
B2
Abstract:
Provided is a semiconductor device having improved heat-dissipating characteristics. The semiconductor device comprises a die pad bonded onto a ceramics substrate, and a die adhered onto the die pad. The die is adhered onto the die pad by means of a sintered body of a metal powder paste. The sintered body of a metal powder paste is a sintered body of a metal powder paste applied to a surface of the die pad. The sintered body of a metal powder paste is a sintered body which, on the surface of the die pad, coats a region in which the die is placed and a region in which the die is not placed. The sintered body of a metal powder paste has a thickness in a range of from 50 to 200 μm.
More Like This:
Inventors:
Kenji Sato
Application Number:
JP2018140554A
Publication Date:
June 24, 2020
Filing Date:
July 26, 2018
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H01L23/15; H01L21/52
Domestic Patent References:
| JP2004039988A | ||||
| JP2011249257A | ||||
| JP2007201346A | ||||
| JP2016031999A | ||||
| JP2014022579A |
Attorney, Agent or Firm:
Ayabune International Patent Office