Title:
回路板上の組付けデバイス及び物体を回路板上に組み付ける方法
Document Type and Number:
Japanese Patent JP6712626
Kind Code:
B2
Abstract:
A mounting device (10) has an abutting portion (112) and pins (114). A mounting method includes disposing the mounting devices (10) on the circuit board (30), passing pins (114) through plated holes (311) of the circuit board (30) and soldering the pins (114) in the plated holes (311), making through holes (21) of the object (20) go through the mounting devices (10), bending the abutting portion (112) to abut an edge of the through holes (21) of the object (20), and thereby mounting and grounding the object (20) on the circuit board (30) via the mounting devices (10). Since the mounting device (10) is firmly mounted on the circuit board (30) by soldering; it is easy to assembly because the mounting device (10) is soldered by a solder oven.
Inventors:
Cai Bunsei
Cao Wei
Page letter
Cao Wei
Page letter
Application Number:
JP2018188271A
Publication Date:
June 24, 2020
Filing Date:
October 03, 2018
Export Citation:
Assignee:
PEGATRON CORPORATION
International Classes:
H05K1/18; H01L23/40
Domestic Patent References:
| JP9510321A | ||||
| JP2014110224A | ||||
| JP9246763A | ||||
| JP2015536040A |
Foreign References:
| US20020114137 | ||||
| US5122480 | ||||
| US5717248 | ||||
| CN102056458A | ||||
| WO2014073528A1 |
Attorney, Agent or Firm:
Sakuo Yamaguchi
Nobuyuki Oshima
Shinjiro Yamaguchi
Nobuyuki Oshima
Shinjiro Yamaguchi