Title:
組成物および成形品
Document Type and Number:
Japanese Patent JP6713600
Kind Code:
B2
Abstract:
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.
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Inventors:
Kazuya Matsumoto
Mitsutoshi Terasakai
Sumito Yamakawa
Tadashi Sakurada
Fumihiro Uetani
Takeshi Noguchi
Mitsutoshi Terasakai
Sumito Yamakawa
Tadashi Sakurada
Fumihiro Uetani
Takeshi Noguchi
Application Number:
JP2018533513A
Publication Date:
June 24, 2020
Filing Date:
August 08, 2017
Export Citation:
Assignee:
Akita University
Daikin Industries, Ltd.
Daikin Industries, Ltd.
International Classes:
C08L27/12; C08L77/00
Foreign References:
| WO2016133108A1 |
Attorney, Agent or Firm:
Atomi International Patent Office