Title:
銅ペースト組成物の製造方法
Document Type and Number:
Japanese Patent JP6716809
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composite particle that can be added as a sintering agent to a conductive paste composition, has excellent oxidation resistance, and can improve the printing properties and sinterability of the conductive paste composition.SOLUTION: A composite particle 20 comprises a copper nuclear particle 21, a plurality of aliphatic carboxylic acid molecules 22 adsorbed on the surface of the copper nuclear particle 21 in the density of 2.5-5.2 molecules per 1 nm, and a plurality of polar organic low molecules 23 that have hydrophilic groups and hydrophobic groups and interact with the plurality of aliphatic carboxylic acid molecules 22.SELECTED DRAWING: Figure 1B
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Inventors:
Kunihiro Fukumoto
Yu Koyama
Yu Koyama
Application Number:
JP2015231261A
Publication Date:
July 01, 2020
Filing Date:
November 27, 2015
Export Citation:
Assignee:
Kyoritsu Chemical Industry Co., Ltd.
International Classes:
B22F1/02; B22F1/00; B22F9/00; C09C1/00; C09C3/08; C09D17/00; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00
Foreign References:
| WO2015064700A1 |
Attorney, Agent or Firm:
Ken Ieiri