Title:
熱処理方法および熱処理装置
Document Type and Number:
Japanese Patent JP6719993
Kind Code:
B2
Abstract:
A heat treatment apparatus is provided with two cool chambers, that is, a first cool chamber and a second cool chamber. A semiconductor wafer before treatment is alternately carried into the first cool chamber or the second cool chamber and then transported to a heat treatment part by a transport robot after a nitrogen purge is performed. The semiconductor wafer after being heat-treated in the heat treatment part is alternately transported to the first cool chamber or the second cool chamber to be cooled. A sufficient cooling time is secured for the independent semiconductor wafer, and a reduction in throughput as the whole heat treatment apparatus can be suppressed.
Inventors:
Takayuki Aoyama
Yasuaki Kondo
Miyawaki Shinji
Shinichi Kato
Kazuhiko Fuse
Hideaki Tanimura
Akira Ueda
Kawahara saki light
Masashi Furukawa
Yasuaki Kondo
Miyawaki Shinji
Shinichi Kato
Kazuhiko Fuse
Hideaki Tanimura
Akira Ueda
Kawahara saki light
Masashi Furukawa
Application Number:
JP2016130051A
Publication Date:
July 08, 2020
Filing Date:
June 30, 2016
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/26; H01L21/265; H01L21/677
Domestic Patent References:
| JP2013207152A | ||||
| JP2011054679A | ||||
| JP2001004282A | ||||
| JP2000243719A |
Foreign References:
| WO2005006426A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita