Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6721128
Kind Code:
B2
Abstract:
A heat sink (4) having a step in a bottom surface corner and a rectangular planar shape is disposed in an interior of a cavity (5) of a metal mold (1) and a first pin (2) is caused to project from a bottom surface of the cavity (5) to position the heat sink (4). A second pin (3) projecting from the bottom surface of the cavity (5) is disposed at the step of the positioned heat sink (4). After the heat sink (4) is positioned, the first pin (2) is lowered to the bottom surface of the cavity (5) and the heat sink (4) is sealed with the mold resin (10) with the second pin (3) being left projecting.
Inventors:
Ken Sakamoto
Application Number:
JP2019537483A
Publication Date:
July 08, 2020
Filing Date:
August 23, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/56; H01L23/28; H01L23/29
Domestic Patent References:
| JP11274196A | ||||
| JP2000183279A | ||||
| JP2003309136A | ||||
| JP1064933A |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno