Title:
研磨用シリカ及びそれを用いた方法
Document Type and Number:
Japanese Patent JP6722026
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing silica additive having no deterioration of surface roughness and scratch resistance and capable of achieving polishing excellent in polishing speed and a polishing slurry containing the same.SOLUTION: There is provided a polishing silica which contains silica (A) having OH group density of 4/nmto 12/nmand sphericity degree of particles with 50 nm or more of 0.80 or more and silica (B) having particle density of 2.0 g/cmor more and average sphericity degree of particles with 50 nm or more of 0.80 or more, and has percentage of the silica (B) based on total mass of the silica (A) and the silica (B) of 10-95 mass%.SELECTED DRAWING: None
Inventors:
Junya Nitta
Atsushi Tsutsumi
Shuji Sasaki
Atsushi Tsutsumi
Shuji Sasaki
Application Number:
JP2016074344A
Publication Date:
July 15, 2020
Filing Date:
April 01, 2016
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2158684A | ||||
| JP2003257903A | ||||
| JP2011077115A | ||||
| JP2014140056A | ||||
| JP2014216369A | ||||
| JP2002294220A | ||||
| JP2014210912A |
Attorney, Agent or Firm:
Masahiro Taguchi