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Title:
接着促進剤、それを含有してなる硬化性オルガノポリシロキサン組成物
Document Type and Number:
Japanese Patent JP6722581
Kind Code:
B2
Abstract:
The present invention provides an adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing this adhesion promoter, and a protective agent or adhesive composition for electric and electronic components. An adhesion promoter containing the following components (A) to (C) in a specific weight ratio, a curable organopolysiloxane composition containing this adhesion promoter, and a particular agent for electric and electronic components: (A) A reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) An organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.

Inventors:
Toyohiko Fujisawa
Harumi Kodama
Application Number:
JP2016512585A
Publication Date:
July 15, 2020
Filing Date:
March 26, 2015
Export Citation:
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Assignee:
Dow Toray Co., Ltd.
International Classes:
C08L83/07; C08K5/5419; C08K5/5435; C08K5/549; C08L83/05; C09D183/05; C09D183/07; C09J183/05; C09J183/07; C09K3/10
Domestic Patent References:
JP2012017427A
JP2007119768A
JP2003221506A
JP64060656A
JP11060952A
JP10195085A
JP2001261963A
Foreign References:
WO2012056850A1