Title:
電子装置
Document Type and Number:
Japanese Patent JP6730495
Kind Code:
B2
Abstract:
To provide an electronic device appropriate for miniaturizing.SOLUTION: An electronic device comprises: a substrate 1; an electronic element 71; and a conductive layer 3. In the substrate, a penetration hole 17 is formed, and further has an insulation layer 2 formed in the substrate. The insulation layer 2 is interposed between the conductive layer 3 and the substrate 1. The insulation layer 2 contains a recess inner surface insulation part 21 formed in an inner surface of an element arrangement recess part 14. The insulation layer 2 contains a penetration hole inner surface insulation part 22 formed in the inner surface of the penetration hole 17. The recess inner surface insulation part 21 includes an auxiliary penetration hole 211 matched with a main surface side end edge of the penetration hole 17 in a thickness direction view. In the auxiliary penetration hole 211, a cross-sectional form in the thickness direction is constant, and the insulation layer 3 is formed in the inner surface of the auxiliary penetration hole 211, and contains an auxiliary penetration hole inner surface insulation part 23 connected to a penetration hole inner surface insulation part 22.SELECTED DRAWING: Figure 2
Inventors:
Isamu Nishimura
Fuwa Yasuhiro
Fuwa Yasuhiro
Application Number:
JP2019131365A
Publication Date:
July 29, 2020
Filing Date:
July 16, 2019
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
| JP2010129870A | ||||
| JP2008016797A | ||||
| JP2002343925A | ||||
| JP2009200228A |
Foreign References:
| US20120104623 | ||||
| GB2150749A |
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui
Nao Usui